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| BYV32-200 SWITCHMODEt Power Rectifier This device is designed for use in switching power supplies, inverters and as free wheeling diodes. Features http://onsemi.com * * * * * * * * Ultrafast 35 Nanosecond Recovery Time 175C Operating Junction Temperature Popular TO-220 Package Epoxy Meets UL 94 V-0 @ 0.125 in High Temperature Glass Passivated Junction Low Leakage Specified @ 150C Case Temperature Current Derating @ Both Case and Ambient Temperatures Pb-Free Package is Available* ULTRAFAST RECTIFIER 16 AMPERES 200 VOLTS 1 2, 4 3 Mechanical Characteristics * Case: Epoxy, Molded * Weight: 1.9 Grams (Approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal * Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current Total Device, (Rated VR), TC = 150C Per Leg Total Device Peak Rectified Forward Current (Rated VR, Square Wave, 20 kHz), TC = 150C - Per Diode Leg Nonrepetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Operating Junction Temperature and Storage Temperature Symbol VRRM VRWM VR IF(AV) 8.0 16 IFM 16 A Value 200 Unit V 1 2 MARKING DIAGRAM 4 Leads are Readily Solderable TO-220AB CASE 221A PLASTIC A YW BYV32-200G AKA 3 A A Y W BYV32-200 G AKA = Assembly Location = Year = Work Week = Device Code = Pb-Free Package = Diode Polarity IFSM 100 A TJ, Tstg -65 to +175 C ORDERING INFORMATION Device BYV32-200 BYV32-200G Package TO-220 TO-220 (Pb-Free) Shipping 50 Units / Rail 50 Units / Rail Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (c) Semiconductor Components Industries, LLC, 2005 1 August, 2005 - Rev. 1 Publication Order Number: BYV32-200/D BYV32-200 THERMAL CHARACTERISTICS (Per Diode Leg) Characteristic Maximum Thermal Resistance, Junction-to-Case Symbol RqJC Value 3.0 Unit C/W ELECTRICAL CHARACTERISTICS (Per Diode Leg) Maximum Instantaneous Forward Voltage (Note 1) (iF = 5.0 Amps, TC = 100C) (iF = 20 Amps, TC = 25C) Maximum Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TC = 100C) (Rated dc Voltage, TC = 25C) Maximum Reverse Recovery Time (IF = 1.0 Amp, di/dt = 50 Amps/ms) (IF = 0.5 Amp, IR = 1.0 Amp, IREC = 0.25 Amp) 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0% vF 0.85 1.15 iR 600 50 trr 35 25 ns mA V 100 IR, REVERSE CURRENT (m A) 70 50 30 20 i F , INSTANTANEOUS FORWARD CURRENT (AMPS) TJ = 175C 10 7.0 25C 5.0 100C 800 400 200 80 40 20 8.0 4.0 2.0 0.8 0.4 0.2 0.08 0.04 0.02 0 20 40 60 TJ = 175C 100C 25C 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (VOLTS) Figure 2. Typical Reverse Current, Per Leg* 3.0 2.0 IF(AV) , AVERAGE POWER DISSIPATION (WATTS) 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 140 145 150 155 160 165 170 175 180 TC, CASE TEMPERATURE (C) SQUARE WAVE dc RATED VR APPLIED * The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if VR is sufficiently below rated VR. 1.0 0.7 0.5 0.3 0.2 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 vF, INSTANTANEOUS VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage, Per Leg Figure 3. Current Derating, Case, Per Leg http://onsemi.com 2 BYV32-200 PF(AV), AVERAGE POWER DISSIPATION (WATTS) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) 14 12 dc 10 8.0 SQUARE WAVE 6.0 4.0 2.0 0 0 20 40 60 80 100 120 140 160 180 200 TA, AMBIENT TEMPERATURE (C) dc SQUARE WAVE RqJA = 16C/W RqJA = 60C/W (NO HEATSINK) 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 IF(AV), AVERAGE FORWARD CURRENT (AMPS) TJ = 175C SQUARE WAVE dc Figure 4. Current Derating, Ambient, Per Leg r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1.0 D = 0.5 0.5 Figure 5. Power Dissipation, Per Leg 0.2 0.1 0.1 0.05 0.05 P(pk) 0.01 SINGLE PULSE 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 t, TIME (ms) t1 t2 0.02 0.01 5.0 10 20 50 100 200 500 1000 DUTY CYCLE, D = t1/t2 ZqJC(t) = r(t) RqJC D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT T1 TJ(pk) - TC = P(pk) ZqJC(t) Figure 16. Thermal Response 1000 C, CAPACITANCE (pF) 300 TJ = 25C 100 30 10 1.0 10 VR, REVERSE VOLTAGE (VOLTS) 100 Figure 17. Typical Capacitance, Per Leg http://onsemi.com 3 BYV32-200 PACKAGE DIMENSIONS TO-220 THREE-LEAD TO-220AB CASE 221A-09 ISSUE AA -T- B 4 SEATING PLANE F T S C NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM A B C D F G H J K L N Q R S T U V Z INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 --- --- 0.080 MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 --- --- 2.04 Q 123 A U K H Z L V G D N R J ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. http://onsemi.com 4 BYV32-200/D |
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